Achieve higher yields, enhanced traceability, and faster ROI with zero-defect quality chip production: Our combinable 2D and 3D analysis systems significantly improve quality assurance by inspecting all chips individually and evaluating the integrated circuit packaging. Integrated at the interface between the front-end and back-end, ISRA inspection systems detect defects in individual components at the wafer level and in the dicing frame. This 100% inspection ensures that only flawless material is sent to the customer.
The downsizing of electronic devices is challenging semiconductor manufacturers to produce smaller component sizes while maintaining tighter process control requirements.
ISRA VISION's wafer inspection solutions for advanced wafer-level packaging ensure traceability throughout the semiconductor manufacturing process. Our systems provide superior quality control for improved device performance, enabling manufacturers to detect, resolve and monitor process deviations in a timely manner.
Features
Typical defects
Microcracks inside the bulk wafer material
Edge chippings
Cracks near edge
Edge contaminations
Technical data
High-resolution line scan cameras with LED line illumination using different wavelengths
Integrated adjustment of thresholds and crack characteristics for sensitive optimization of the detection result
Typ. resolution: 20 μm, optional down to 1.5 μm
Semi standard interface
Re-thinning can introduce defects on the wafer's surface that can impact the performance and functionality of the final semiconductor device.
Therefore, optical inspection after re-thinning is crucial to detect defects that could impact device functionality.
Conducting optical inspection after the re-thinning process allows manufacturers to minimize the risk of defects and ensure that the final semiconductor devices meet the required performance and reliability standards. This helps to enhance the overall quality and yield of the semiconductor manufacturing process.
Features
Typical defects
Technical data
Dicing wafers carries the risk of defects in the dicing streets. Accurate inspection of the dicing street reliably detects these defects and minimizes the scrap rate of chips and dies. The DicingScan inspection tool provides 100% wafer inspection. High-performance line scan cameras precisely detect defects such as edge chippings in the dicing streets. In addition, the tool checks the presence, position, and completeness of the dicing streets.
With our patented MultiView imaging technology, which forms the basis of the WafQScan process, users can also inspect the rear side of the wafer through the carrier tape (foil). DicingScan ensures that only dies/chips of impeccable quality are processed.
Dicing street inspection immediately after dicing
(Micro-)crack inspection on dies
Check the position, integrity, and quality of dicing strees
Front and rear side inspection, even through the carrier tape
Typical defects
Uncompleted dicing
Cracks
Bubbles
Releases
Chip-outs
MultiView technology with simultaneous image capturing
Semi standard interface
For the efficient and future-proof operation of your production systems our highly qualified service teams support you globally in all matters. We provide the implementation, maintenance and servicing as well as the analysis and optimization of your systems - quickly, reliably, 24/7.
Visit our service center and request your customized service solution.
Furthermore, learn in the ISRA VISION Academy how our competent trainers always keep your employees up to date with the latest knowledge so that system operators, product engineers and quality managers become real inspection experts.
Visit our ISRA VISION Academy and book your individual and scalable trainings.
Director Sales SEMI-EL
Hainbuchenring 9-11
82061 Neuried
germany